Reliability Analysis of Three Dimensional Chip Stacking Electronic Packaging with Through Silicon Vias and Micro-bump Interconnects
碩士 === 國立清華大學 === 動力機械工程學系 === 101
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61831818341958964899 |