Investigating the Temperature Effect of Reliability on Integration IC 3D Packaging under Drop Test
碩士 === 國立清華大學 === 動力機械工程學系 === 101 === Due to the development of technology and the users demand, electronic packaging has been evolved from the traditional single chip package to a multi-chip package, i.e., three-dimensional integrated circuit package. The main advantages of three-dimensional integ...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/02406515341621108600 |