Design of Millimeter Wave QFN Package using Defected Ground Structure Technique
碩士 === 國立中山大學 === 通訊工程研究所 === 101 === This thesis includes five chapters. Chapter I, background and motivation in this thesis are introduced. Chapter II addresses IC package characteristics and the interface between chip and package at millimeter-wave frequencies. We review several advanced packages...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99930469198054655741 |