Built-In Test and Measurement Techniques for Through-Silicon Vias of 3D ICs
碩士 === 國立中央大學 === 電機工程學系 === 101 === Three-dimensional (3D) integration technology using through-silicon via (TSV) is one emerging integrated circuit (IC) technology. A 3D IC consists of multiple dies vertically connected by TSVs. The manufacturing process of a 3D IC can be roughly divided into two...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/awq4ha |