The improvement on the bonding strength between diamond particles and the piano wire for high speed ingot cutting

• Main Authors: Lin, Tai-Huang, 林泰宏
• Other Authors: Wu, Yew-Chung
• Format: Others
• Language: zh-TW
• Published: 2012
• Online Access: http://ndltd.ncl.edu.tw/handle/evddnw

碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 101 === This thesis is mainly researching for solar cell and light-emitting diode, it can divide ingot into wafer. In this manufacturing process, what it uses is the fixed-abrasive with high speed wire saw. According to the statistics, currently for those sapphire-processing factories in our country, the demand in every month of wire saw is more than 5,000Km, meanwhile adding the demand from solar cell industry, and its finical scale is definitely over ten million. Because of this reason, diamond will be generally used. However, the global market now has been monopolized by Japan Company and the price is always staying high. Therefore, in order to avoid the source monopolized by foreign countries, I worked on this research. This thesis mainly investigates the combination power between diamond and piano wire. In the process of experiment, through the researching and selection, we found that diamond by means of changing its essence of its surface can let our experiment reach the best conditions and that its surface with nickel can make it more magnetic. On the other hand, we can use the magnetic system to make piano wire magnetic and due to the magnet attracting principle diamond will naturally attach on the piano wire. Moreover, as the surface of diamond has coated nickel so when we do the coating procedure, we can coat both diamond and piano wire with nickel, coving the diamond with nickel. What it produced after the experiment is the cutting line and it can do the abrasive test for some stiff and crisp material. As a result, this test is also evidenced that the diamond through the changing of its essence on the surface is appreciate to produce high speed wire saw.