The improvement on the bonding strength between diamond particles and the piano wire for high speed ingot cutting
碩士 === 國立交通大學 === 工學院半導體材料與製程設備學程 === 101 === This thesis is mainly researching for solar cell and light-emitting diode, it can divide ingot into wafer. In this manufacturing process, what it uses is the fixed-abrasive with high speed wire saw. According to the statistics, currently for those sapphi...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/evddnw |