Study on Cu/Ti bonding and its applications in 3D IC
碩士 === 國立交通大學 === 電子研究所 === 101 === This thesis focuses on researches of co-sputtering metal bonding in three-dimension integrated circuits (3DIC). Several co-sputtering metal species, such as copper (Cu) and titanium (Ti), are investigated. The corresponding bonding conditions are optimized as well...
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47920105215602384263 |