The electromigration failure mode of low-bump-height Sn2.3Ag solder with different under-bump-metallizations
碩士 === 國立交通大學 === 材料科學與工程學系 === 101 === With the trend of miniaturization, the electronic device becomes smaller and smaller. In addition, the electronic device require some more features, such as small volume of solder bump, better electrical performance and higher I/O density. With all these deman...
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| Format: | Others |
| Language: | zh-TW |
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2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16991498696201419144 |