A Study on the Electrification Fracture Characteristics of Pure Sn and Sn-Based Solder Alloys
博士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 101 === Microminiaturization of electronic products may lead solder joints to fusion failure during the electrification. Additionally, developing current-resistant lead-free solders is imperative for lead-free issues. In order to investigate how solders act in...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52625045809815919621 |