Development of a Novel Finite Element/Matlab Integration Scheme for Chemical Mechanical Polishing Applications
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 101 === Chemical mechanical polishing (CMP) has been recognized as the most effective planarization technology in wafer processing, and its plays an important role in the state of the arts integrated circuits (IC) fabrication. For CMP, the polishing uniformity of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/97435673569521872487 |