Interval Optimization of Fatigue Life for PoP Package by Genetic Algorithm

碩士 === 國立成功大學 === 工程科學系碩博士班 === 101 === To meet the demands for miniaturization, lightening, high performance, low cost and multi-functions in electronics industries, the Package-on-package (PoP) stacking approach is recognized as an economical solution for integrating the logic and memory devices t...

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Bibliographic Details
Main Authors: Hsueh-LiangChu, 朱學良
Other Authors: Rong-Sheng Chen
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/86990578049275754248