Analysis of Heat Transfer Characteristics for LED Module
碩士 === 國立中興大學 === 機械工程學系所 === 101 === A study to the characteristics of heat transfer in high power LED modules were carried out systematically based on experimental results for a variety of LED packaging, heat spreaders and heat dissipation modules. The flip chip type LED has less thermal resistanc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/gydftb |