Research for the Effects of Copper Wire Bonding Process on Coverage of Intermetallic Compounds
碩士 === 國立中興大學 === 機械工程學系所 === 101 === In this thesis, we are focusing on the coverage rate and area of the inter-metallic compounds (IMC) during copper wire bonding process, effect by the setting of the scrub on/off mode in 1st bond process and the surface quality of the capillary. Also, other requi...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/5h5nc7 |