The study of cutting optimization for wafer level packaging
碩士 === 國立中興大學 === 物理學系所 === 101 === The purpose of this research is to explore wafer cutting metal layer and the silicon layer invisible crack problem by wafer packaging process. Business circles increase the laser grooving before wafer cutting process. The wafer pre-cut is to solve wafer crack of c...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/27562748482754785012 |