Electroless Deposition of Cu(Re) Alloy Film for Self Formation of Re Diffusion Barrier
碩士 === 國立中興大學 === 材料科學與工程學系所 === 101 === As the line width and spacing of intergrated circuits continually decrease, copper with low electrical resistivity and high electromigration resistance has been widely used as an interconnect material. To inhibit rapid copper diffusion into silicon devices,...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/51178623093623374968 |