Diffusion Resistant Ability and Enhancement Mechanism of Multi-component Alloy and Nitride Films
碩士 === 國立中興大學 === 材料科學與工程學系所 === 101 === With the rapid development of copper metallization technology and the decrease in the line spacing of integrated circuits, there is a need of thin but thermally stable diffusion barrier layer to inhibit the diffusion of copper atoms. Recent studies indicate t...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53267362682691857513 |