Cu Electroplating for Through Silicon Vias Filling Using a Dimensionally Stable Anode
碩士 === 國立中興大學 === 化學工程學系所 === 101 === Nowadays, the contact distance between electronic devices has become much shorter with the trend of electronic product miniaturization. Copper electroplating is used to make interconnects in integrated circuit (IC) manufacturing. To promote transmission speed of...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/84992471750237289351 |