Optimization Parameters for Second Bond at Zero Time Using a Ball Grid Array through Taguchi Experiments

• Main Authors: Feng-Sheng Lee, 李豐昇
• Other Authors: Cheng-Hong Yang
• Format: Others
• Language: zh-TW
• Published: 101
• Online Access: http://ndltd.ncl.edu.tw/handle/30095821822708572640

碩士 === 國立高雄應用科技大學 === 電子工程系 === 101 === In recent years, the rapid expansion of the IC and semiconductor industries has forced manufacturers to reduce R&D cycles, product sizes and product life cycles, while improving production efficiency of production. In semiconductor packaging, given the same volume, the greatest external pin count is found in ball grid array (BGA) products. To improve semiconductor packaging technologies, manufacturers are actively developing new technologies and upgrading existing processes to save time and costs while increasing quality. Semiconductor packaging processes play a key role in the wire bonding process. The main purpose of wire bonding is to use conductive wires to help connect the die’s contact pads to the lead frame’s inner lead, thus the IC grain function allows for signals to be transmitted through electric circuits to the outside world. During the wire bond process, the contacts welded to the die’s contact pads constitute the first bond, while the second bond is welded to the inner lead. The duration of the wire bonding process determines the quality and yield. Optimization parameters for the Second Bond at zero time are determined using a ball grid array through Taguchi experiments, thereby reducing the time required for wire bonding and thus increasing production capacity.