Optimization Parameters for Second Bond at Zero Time Using a Ball Grid Array through Taguchi Experiments

碩士 === 國立高雄應用科技大學 === 電子工程系 === 101 === In recent years, the rapid expansion of the IC and semiconductor industries has forced manufacturers to reduce R&D cycles, product sizes and product life cycles, while improving production efficiency of production. In semiconductor packaging, given the sam...

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Bibliographic Details
Main Authors: Feng-Sheng Lee, 李豐昇
Other Authors: Cheng-Hong Yang
Format: Others
Language:zh-TW
Published: 101
Online Access:http://ndltd.ncl.edu.tw/handle/30095821822708572640