Mold Filling and Warpage Reduction Analysis for the Protective Cover of a Cell Phone

碩士 === 國立高雄應用科技大學 === 模具系碩士在職專班 === 101 === Plastic injection molding for modern electronic products are an important process, In the early the experience of injection molding need to be experimented by actual injection machines and molds real parameter setting. This paper is the use of actual co...

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Bibliographic Details
Main Authors: LEE,CHIH-JUNG, 李智榮
Other Authors: Wu,Cheng-Hsien
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/58857977091302256832