Mechanical Properties of Cu Films Under Drilling and Milling Process Using Molecular Dynamics

碩士 === 國立高雄應用科技大學 === 機械與精密工程研究所 === 102 === The objective of this study are explored the behavior of copper samples under drilling and milling using molecular dynamics simulation. Content the drilling, the nanoindentation and nanodrilling simulation to compare nano characteristics and shaping prin...

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Bibliographic Details
Main Authors: Ching-Hung Kuo, 郭謦鋐
Other Authors: Te-Hua Fang
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/01120846635178282893