A Study of The Die Bonding Shift By Taguchi Method

碩士 === 國立高雄應用科技大學 === 電機工程系博碩士班 === 101 === With the constant evolution of semiconductor technology, we used electronic products from the purely practical nature,continuously improve value of light weight, ultra thin, short, small, multi-function,huge memory capacity and high-performance.The electro...

Full description

Bibliographic Details
Main Authors: Yi-Jui Yu, 游易叡
Other Authors: Hsiao-Yi Lee
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/9d95b8