Thermal Convection Cooling Behavior of Aluminum Board with Micro Channel Structure
碩士 === 遠東科技大學 === 機械工程研究所 === 101 === As the incomplete contact between heat source and heat sink, the temperature of the heat source will be increased, because a high thermal resistance of the air layer reduces the heat conduction effect. In the past research, they are studied the uses of therm...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/84mt45 |