| Summary: | 碩士 === 遠東科技大學 === 機械工程研究所在職專班 === 101 === The purpose of this paper is to perform the heat dissipation design, simulation and investigation for the boost circuit board, which was placed within the three-dimensional channel, by applying numerical simulation method. First, three cooling modes including natural convection, force convection and special cooling assembly are planed and designed to reduce the temperature of electronic components on the boost circuit board. Then, the influences on the temperature of electronic components due to the change design parameters will be investigated by executing a serious of heat dissipation testing for different cooling modes respectively. Furthermore, the feasibility of cooling and optimum design parameters for each cooling mode, also the optimum cooling mode will be found after comparing the optimum design results of cooling modes.
The study results show that if the temperature of power transistor(MOS) be used for evaluation criteria of cooling effective, the "special assembly" cooling design has the cooling efficiency (the MOS’s temperature can dropped to 33℃); secondly was “forced convection” (the MOS’s temperature can dropped to 45.4℃); worst was "natural convection",(the MOS’s temperature only can dropped to 73.5℃ and unable to meet the cooling requirements that the MOS’s temperature under 65 ℃). Besides, if the overall temperature of boost circuit board be used for evaluation criteria of cooling effective, the “forced convection” design mode has the best overall cooling effect, it can drop the temperature of all the electric components (including transformers) to below 50℃. Finally, if the main considerations of cooling design is based on the heat dissipation demand of the converter circuit and operational stability and reliability of cooling system, the "special assembly" will be the best choose.
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