The Study of Convection Heat Dissipation of Electric Parts in the Three-Dimensional Channel
碩士 === 遠東科技大學 === 機械工程研究所在職專班 === 101 === The purpose of this paper is to perform the heat dissipation design, simulation and investigation for the boost circuit board, which was placed within the three-dimensional channel, by applying numerical simulation method. First, three cooling modes includin...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/98761414497338503379 |