Effects of Minor Co Addition upon Sn-Cu/Ag, Sn-Cu/Ni,and Sn-Cu/Cu Interfacial Reactions
碩士 === 中原大學 === 化學工程研究所 === 101 === Minor Co addition into the solders is a promising method to improve the solder, and thus the soldering joint properties. However, the complete investigations regarding to the interfacial reactions between Co-alloying solders and the frequently encountered surfac...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/61212780969075630574 |