The adhesion improvement of Cu films on the SiO2 substrate
碩士 === 正修科技大學 === 電機工程研究所 === 101 === This paper is designed to use different layers of intermediary materials pass into the gas-evaporation of Cu films on high-temperature annealing, the and observe their characteristics after annealing. Deposition of complete evaporation of Cu films unfolds anneal...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61223017760915103990 |