JEITA Board Level Drop Impact Analysis and Simulation for Multi-stack BGA Package
碩士 === 中華大學 === 機械工程學系碩士在職專班 === 101 === As components integration, integrating more than a semiconductor chip become more complicated and harder to understand than single component on a package has increased considerably in the last decade. This integrated package has certainly created a great deal...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/gehc8e |