Effects of Material Properties, Stacking Type, Process and Residual Strains on Thermal Deformation of Stacked Die Packages
碩士 === 長庚大學 === 機械工程學系 === 101 === Multi-Chip Package (MCP) has gained increasingly interest in IC assembly industry. For increasing the chip number in the same package size or even smaller, the constituent materials of MCP should be smaller and thinner. The package tends to suffer from large deform...
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| Format: | Others |
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2013
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| Online Access: | http://ndltd.ncl.edu.tw/handle/95233288527583909897 |