A Numerical Analysis of the Flexural Strength of Thin TSV Wafer Die
碩士 === 國立中正大學 === 機械工程學系暨研究所 === 100 === Light weight, small size, low voltage, and low cost are the mainly request of high performance IC product; on the other hand, it also means the spacing for IC system is very limited. Therefore to develop the Through Silicon Via (TSV) Stacked-Die Packaging (SD...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20325665312785456956 |