Thermal Performance Analyses on New Diode Structure Designs for Power Adapter
碩士 === 國防大學理工學院 === 機械工程碩士班 === 101 === This thesis focus on thermal and thermo-stress analyses on Schottky Diode and Bridge Rectifier manufactured by Z company, and both of the components are applying on power adapters of the Apple products. Through thermal and thermal-stress simulations on the two...
Main Authors: | Chung-I Wu, 吳忠益 |
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Other Authors: | Ben-Je Lwo |
Format: | Others |
Language: | zh-TW |
Published: |
2013
|
Online Access: | http://ndltd.ncl.edu.tw/handle/89707149005289649607 |
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