Thermal Performance Analyses on New Diode Structure Designs for Power Adapter

碩士 === 國防大學理工學院 === 機械工程碩士班 === 101 === This thesis focus on thermal and thermo-stress analyses on Schottky Diode and Bridge Rectifier manufactured by Z company, and both of the components are applying on power adapters of the Apple products. Through thermal and thermal-stress simulations on the two...

Full description

Bibliographic Details
Main Authors: Chung-I Wu, 吳忠益
Other Authors: Ben-Je Lwo
Format: Others
Language:zh-TW
Published: 2013
Online Access:http://ndltd.ncl.edu.tw/handle/89707149005289649607