Thermal Performance Analyses on New Diode Structure Designs for Power Adapter

• Main Authors: Chung-I Wu, 吳忠益
• Other Authors: Ben-Je Lwo
• Format: Others
• Language: zh-TW
• Published: 2013
• Online Access: http://ndltd.ncl.edu.tw/handle/89707149005289649607

碩士 === 國防大學理工學院 === 機械工程碩士班 === 101 === This thesis focus on thermal and thermo-stress analyses on Schottky Diode and Bridge Rectifier manufactured by Z company, and both of the components are applying on power adapters of the Apple products. Through thermal and thermal-stress simulations on the two components during operation, this thesis first studies the thermal resistance of different packing designs, and whether the products are beyond the material limitations. Secondly, Schottky diode and Bridge Rectifier from Z company and K Company are compared to study the differences. Based on the works in this thesis, not only thermal and thermal-stress behaviors on the components were studied, possible improvement on Z company products were also proposed.