The Application of boundary element method to simulate the stress distribution and nonuniformity on wafer surface of chemical mechanical polishing process
碩士 === 元智大學 === 機械工程學系 === 100 === Chemical mechanical polishing (CMP) is important in improving planarization and materials remove ratio of wafer in semiconductor manufacturing. We used a method, boundary element method (BEM), can reduce computer memory and computing time to simulate the CMP proces...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/45011651755032571334 |