| Summary: | 碩士 === 元智大學 === 機械工程學系 === 100 === Electronic products have to go through a series of reliability test before they are launched to market. Thermal Cycling Test (TCT) is the most widely used test among these reliability tests. However, it often takes too much time thus causes a bottleneck in the test lab loadings. Therefore, Thermal Cycling Test is usually replaced by the mechanical bending test and shearing test owing to the shorter testing time. But what is the difference between thermal stress and mechanical stress during the Thermal Cycling Test of electronic components? Then we have to discuss their relationship before using the replaced way.
For this reason, this paper is mainly talking about the basic theories of Thermal Cycling Tests. Accelerating the Thermal cycling test by Low Temperature Range Thermal Cycling Test and the high temperature range individually, making a series of tests for commonly used Flip Chip Ball Grid Array, and estimate the fatigue life by fatigue theory at the same time. Then using four-point bending test, assuming the stress and strain under the Thermal cycling Test, and discuss the relationship between fatigue life and reliability. Also by Finite Element Method (FEM) to analyze Solder ball’s stress, estimating the thermal stress of products and comparing with the experimental data.
This paper tests Thermal Cycling Test and Accelerating Thermal Cycling Test from different controlling parameters. According to the experimental data, not only the temperature rate but the temperature range of Thermal Cycling Test will influence the thermal stress, strain and sample’s life directly. Finding sample’s life by Low Temperature Range Thermal cycling Test (0~100℃), then using Inverse Power Equation to calculate the parameter of material and estimate Accelerating Thermal Cycling Test (-55~150℃) life. Compare the theory life with the test of Accelerating Thermal Cycling Test (-55~150℃) life of examples. Though the samples were not enough to reduce error, it was still in an accept range by accelerating factor relationship. Therefore, we can use this way to estimate the sample’s life more effectively by using Accelerating Thermal Cycling’s experimental data in Low Temperature Range Thermal Cycling Test’s calculation.
|
|---|
