Effects of Accelerate Thermal Cycling Test on the Reliability Life of Electronic Components
碩士 === 元智大學 === 機械工程學系 === 100 === Electronic products have to go through a series of reliability test before they are launched to market. Thermal Cycling Test (TCT) is the most widely used test among these reliability tests. However, it often takes too much time thus causes a bottleneck in the te...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/52588688436694111691 |