Comparative Study between Palladium-Phosphorus and Pure Palladium Thin Film in the Reaction between Tin-Silver-Copper Alloy and Gold/Palladium/Nickel Tri-Layer

碩士 === 元智大學 === 化學工程與材料科學學系 === 100 === Recently, the Pd (or Pd-P) film had been deposited over the Ni(P)metallization pads for high-end packaging applications. This was because an adequate Pd layer can prevent the Ni(P) from the galvanic attack derived from the immersion Au plating process; thus a...

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Bibliographic Details
Main Authors: Yen-Chen Lin, 林彥辰
Other Authors: Cheng-EnHo
Format: Others
Language:zh-TW
Online Access:http://ndltd.ncl.edu.tw/handle/54318707451471389801