A Study of Metallization Pads Dissolution/Diffusion Behavior and Their Cross-Interaction in Microelectronic Solder Joints
碩士 === 元智大學 === 化學工程與材料科學學系 === 100 === In the first part of this study the interactions between Ni and Cu during pad dissolution, compound layer formation, and solder microstructure evolution were systematically investigated using a Ni/Sn3.5Ag/Cu joint structure that was fabricated via three variou...
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| Format: | Others |
| Language: | en_US |
| Online Access: | http://ndltd.ncl.edu.tw/handle/60224580568179023710 |