Bubble Defects Inspection on LED Sealing Glue Images

碩士 === 國立雲林科技大學 === 資訊工程系碩士班 === 100 === Bubble defect inspection is an important step in light-emitting diode (LED) packaging processes. It is difficult to detect bubble defects because bubbles are transparent and have irregular shape in LED sealing glue images. Traditionally, experienced engineers...

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Bibliographic Details
Main Authors: Yi-Feng Lin, 林宜鋒
Other Authors: Chuan-Yu Chang
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/97676775986568405068