The Analysis of Forming Limit of Electrodeposited Copper Foil and Rolled Copper Foil in Micro Square-Cup Deep Drawing Process
碩士 === 淡江大學 === 機械與機電工程學系碩士班 === 100 === This study applied the dynamic-explicit finite element method to perform the forming limit analysis on the electrodeposited copper foil and the rolled copper foil in the micro deep drawing process of a square cup. Under the condition of isotropic materials, t...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65460195952542243078 |