By Using Electromagnetic Bandgap in the Improvement of Power Integrity and Signal Integrity for High-Speed Printed Circuit Board

碩士 === 聖約翰科技大學 === 電子工程系碩士在職專班 === 100 === In this thesis, we study and investigate the benefits of implementing three different Electromagnetic Band Gap (EBG) structures, such as Uniplanar Compact (UC), L-bridged and L-Bridged plus Slits (LBS), in the reduction of PCB power supply interference and...

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Bibliographic Details
Main Authors: LIN LUNG TE, 林龍德
Other Authors: 周允仕
Format: Others
Language:zh-TW
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/15102467256984467874