Construction of the Measurement Device for the Shear Strength and Application of Die-Attached Bonding
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 100 === Abstract This study focused on the chip bonding in the electronic assembling process and self-designed a shear stress measurement system to measure the bonding force between LED chip and substrate, which utilized the linear movement principle to drive th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/7e8ur8 |