Fatigue Life and Reliability Analysis of Electronic Packages under High Temperature and Moisture Conditions
碩士 === 國立臺灣大學 === 機械工程學研究所 === 100 === Many previous researches on electronic packages focused on assessment of package lives under a single state of stress such as vibration, thermal cycling, drop impact, temperature and humidity. The present study considers both effects of thermal cycling and mois...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/66664685973269858086 |