3D IC Thermal Simulation Algorithm Using the Finite Difference Method and the Green''s Function
碩士 === 國立臺灣大學 === 電子工程學研究所 === 100 === Nowadays, in the design of many-core processor, it is necessary to make temperature simulation of full die for the design of one core. It is requested to see more than one million mesh grids in a 3D plane in a full chip thermal simulation. For packing more devi...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/63679192130433605464 |