Effects of Sn Anisotropy and Ag Addition on Electromigration
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 100 === Two main topics were discussed in this thesis, including the effect of Ag addition and the Sn grain orientation on the electromigration. The line-type solder joints were designed for the electromigration test in both topics in order to exclude some addit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/15577028079634392630 |