Study on InGaN/GaN Quantum Well Structures on Si Substrate with Transmission Electron Microscopy

碩士 === 國立臺灣大學 === 光電工程學研究所 === 100 === The difference of thermal expansion coefficient between GaN and Si results in a strong tensile stress on the GaN epitaxial layer during the cooling process. In our study, we create a compressive thermal stress by using an AlN buffer layer grown with graded tem...

Full description

Bibliographic Details
Main Authors: Yen-Hung Liu, 劉彥宏
Other Authors: Chih-Chung Yang
Format: Others
Language:en_US
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/25988065222972125041