Electromigration-induced failure on lead-free micro bumps in three-dimensional integrated circuits packaging
碩士 === 國立清華大學 === 工程與系統科學系 === 100 === Nowadays, due to the trend in having multiple functions and greater performance of consumer electronic products, traditional Al or Cu wire bonding technology is insufficient to serve this high density packaging. Flip chip technology was then developed to meet...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2012
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| Online Access: | http://ndltd.ncl.edu.tw/handle/17406141251982654023 |