Built in Self Repair for Weakly TSV

碩士 === 國立清華大學 === 電機工程學系 === 100 === In this thesis, we propose a built in self repair (BISR) method that can automatically repair the large propagation delays across the Through Silicon Vias (TSVs) in a 3D IC. We adopt the concept of the oscillation ring (OR) test, in which two TSVs are connected w...

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Bibliographic Details
Main Authors: Tsai, Meng Hsiu, 蔡孟修
Other Authors: Huang, Shi-Yu
Format: Others
Language:en_US
Published: 2011
Online Access:http://ndltd.ncl.edu.tw/handle/56813702203357248466