Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide

碩士 === 國立中山大學 === 電機工程學系研究所 === 100 === In this study, the thin titanium oxide (TiO2) film deposited on InP substrate was prepared by atomic layer deposition (ALD), which was used as gate oxide of InP Schottky barrier MOSFET. First, aluminum oxide (Al2O3) by ALD can be used as improvement in oxide o...

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Main Authors: Sheng-Hsiung Yang, 楊勝雄
Other Authors: Ming-Kwei Lee
Format: Others
Language:en_US
Published: 2012
Online Access:http://ndltd.ncl.edu.tw/handle/61330678165215742273
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spelling ndltd-TW-100NSYS54420822015-10-13T21:22:19Z http://ndltd.ncl.edu.tw/handle/61330678165215742273 Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide 二氧化鈦閘極氧化層之磷化銦蕭特基能障金氧半電晶體元件研製與特性分析 Sheng-Hsiung Yang 楊勝雄 碩士 國立中山大學 電機工程學系研究所 100 In this study, the thin titanium oxide (TiO2) film deposited on InP substrate was prepared by atomic layer deposition (ALD), which was used as gate oxide of InP Schottky barrier MOSFET. First, aluminum oxide (Al2O3) by ALD can be used as improvement in oxide of TiO2. Al2O3 of ALD has self-cleaning which can improve interface between oxide and substrate, the leakage current densities can reach 3.1 × 10-9 and 3.3 × 10-7 A/cm2. The Schottky barrier height(ΦBp) of Al/InP with (NH4)2S treatment is 0.968 eV, which is higher than that of Al/InP without (NH4)2S treatment (0.806eV). The (NH4)2S solution is a moderate etchant to reduce surface oxides on InP. Therefore, Schottky barrier will not be influenced by Fermi level pinning. The electrical characteristics of Schottky barrier MOSFET with TiO2 as gate oxide were measured in this report. The drain current is 1.73μA. The drain current increases rapidly when drain voltage is over 1V, it indicates that breakdown field of TiO2 thin film is not high enough. Due to advantages of ALD-Al2O3, such as self-cleaning ability and high breakdown field, the TiO2/Al2O3 prepared by ALD structure was used to improve the problem mentioned above. The electrical characteristics are much improved compared with a single TiO2 film, and drain current can reach 1.37 μA. The rapid increase of drain current with the increased drain voltage is not observed. The transconductance and mobility are 4.45 × 10-7 S/μm and 202.3 mm2/V-s, respectively, and a good sub-threshold behavior is obtained. Compared with other researches, we can find that Schottky barrier in on-state is higher than that of silicide sample. It indicates the InP Schottky barrier MOSFET characteristics are limited by high Schottky barrier. Ming-Kwei Lee 李明逵 2012 學位論文 ; thesis 117 en_US
collection NDLTD
language en_US
format Others
sources NDLTD
description 碩士 === 國立中山大學 === 電機工程學系研究所 === 100 === In this study, the thin titanium oxide (TiO2) film deposited on InP substrate was prepared by atomic layer deposition (ALD), which was used as gate oxide of InP Schottky barrier MOSFET. First, aluminum oxide (Al2O3) by ALD can be used as improvement in oxide of TiO2. Al2O3 of ALD has self-cleaning which can improve interface between oxide and substrate, the leakage current densities can reach 3.1 × 10-9 and 3.3 × 10-7 A/cm2. The Schottky barrier height(ΦBp) of Al/InP with (NH4)2S treatment is 0.968 eV, which is higher than that of Al/InP without (NH4)2S treatment (0.806eV). The (NH4)2S solution is a moderate etchant to reduce surface oxides on InP. Therefore, Schottky barrier will not be influenced by Fermi level pinning. The electrical characteristics of Schottky barrier MOSFET with TiO2 as gate oxide were measured in this report. The drain current is 1.73μA. The drain current increases rapidly when drain voltage is over 1V, it indicates that breakdown field of TiO2 thin film is not high enough. Due to advantages of ALD-Al2O3, such as self-cleaning ability and high breakdown field, the TiO2/Al2O3 prepared by ALD structure was used to improve the problem mentioned above. The electrical characteristics are much improved compared with a single TiO2 film, and drain current can reach 1.37 μA. The rapid increase of drain current with the increased drain voltage is not observed. The transconductance and mobility are 4.45 × 10-7 S/μm and 202.3 mm2/V-s, respectively, and a good sub-threshold behavior is obtained. Compared with other researches, we can find that Schottky barrier in on-state is higher than that of silicide sample. It indicates the InP Schottky barrier MOSFET characteristics are limited by high Schottky barrier.
author2 Ming-Kwei Lee
author_facet Ming-Kwei Lee
Sheng-Hsiung Yang
楊勝雄
author Sheng-Hsiung Yang
楊勝雄
spellingShingle Sheng-Hsiung Yang
楊勝雄
Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide
author_sort Sheng-Hsiung Yang
title Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide
title_short Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide
title_full Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide
title_fullStr Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide
title_full_unstemmed Fabrication and characterization of InP Schottky barrierMOSFET with thin TiO2 gate oxide
title_sort fabrication and characterization of inp schottky barriermosfet with thin tio2 gate oxide
publishDate 2012
url http://ndltd.ncl.edu.tw/handle/61330678165215742273
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