Study on fabrication and characteristics of Zr-doped SiO2 thin film resistance random access memory
碩士 === 國立中山大學 === 材料與光電科學學系研究所 === 100 === With the progress of technology, large capacity and scalable are required for the future. Recent years, the physical limit is approached and a next-generation memory is needed in the future. In addition, non- volatile memory occupies more than 96% in...
Main Authors: | Yin-chih Pan, 潘盈志 |
---|---|
Other Authors: | Tsung-Ming Tsai |
Format: | Others |
Language: | en_US |
Published: |
2012
|
Online Access: | http://ndltd.ncl.edu.tw/handle/00984147015170388301 |
Similar Items
-
Study on fabrication and characteristics of Zn-doped SiO2 thin film resistance random access memory
by: Cheng-Wei Tung, et al.
Published: (2011) -
The Characterization of Sn-doped SiO2 Thin Film Resistance Random Access Memory
by: Kuo-Hsiao Liao, et al.
Published: (2011) -
Characteristics of Cu-doped SiO2 Thin Film for Resistance Random Access Memory Application
by: Po-Wei Sung, et al.
Published: (2010) -
Study on characteristics of SiO2-doped HfO2 thin film resistance random access memory
by: Han-Kuang Peng, et al.
Published: (2013) -
Low-temperature PZT thin-film ferroelectric memories fabricated on SiO2/Si and glass substrates
by: D.H. Minh, et al.
Published: (2016-03-01)